Forschungsprojekt am Institut

Strain Sense
Condition Monitoring Systems grant an online observation of static and dynamic stresses, and can monitor security relevant components like airplane wings or wind turbine blades, or can foster tactile robotics if miniaturization is mastered.

At the Institute for Integrated Circuits we want to integrate all the necessary components for mechanical stress measurement on a single chip, including the sensors itself as well as all the circuitry needed for a detailed on-chip evaluation and data transfer.

Contact: M. Sc. Kim Allinger